26TH INTERNATIONAL WORKSHOP

THERMAL INVESTIGATIONS OF ICS AND SYSTEMS


THERMINIC 2020 goes online – 24 September 2020

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems.

Welcome to

THERMINIC 2020

THERMINIC 2020 goes online – 24 September 2020

It has become clear in recent weeks that we will not be able to hold a live THERMINIC Workshop this year. For this reason, we are moving the 26th International Workshop on Thermal Investigations of ICs and Systems THERMINIC into the virtual world, combining pre-recorded video presentations with an exciting and interactive digital conference format, hosted on 24 September 2020.

Therminic Newsletter

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Abstract submission extended to June 30, 2020
We have re-opened the abstract submission and encourage you to submit an abstract for this year’s THERMINIC Workshop by June 30 at https://www.conftool.pro/therminic2020/.

All authors who have already submitted their abstracts will be informed about acceptance in the first week of July. As usual, all conference papers will be made available in the conference proceedings and be published through IEEE Xplore.

Meet us online on September 24, 2020!
We are currently finalizing our agenda and the details of our new format to bring you the most inspiring, lively, interactive THERMINIC Workshop that the current circumstances allow… You can look forward to live presentations of the keynote and the 15 highest ranked papers, short pitches of all other presentations, live debates and the best paper award ceremony!

Pre-recorded online presentations
To limit the live event online to one day and to still give you the chance to see as many presentations as possible, all contributions will be made available to you online as video presentations 10 days prior to the conference. This gives you the opportunity of viewing all presentations in your own time (within a given time frame of several weeks).

To take into account the new conference format, participation fees will be substantially reduced.

Although we are sad that we won’t the opportunity to meet all of you in person, we are looking forward to welcoming the THERMINIC community online!

Bernhard Wunderle
Therminic 2020 Program Chair

Submissions

We invite delegates to consider submitting abstracts that are related to, but not limited to, the following topics:

  • Thermal Phenomena, Simulation and Experiment
  • Electronics Cooling Concepts
  • Thermo-Mechanical Reliability

Sponsoring

More than 100 participants from over 25 countries are expected at THERMINIC 2020, making the conference the ideal platform to provide your company with an exceptional level of international exposure for your products and services and to significantly enhance your standing and reputation with regard to thermal investigations!

Venue

The THERMINIC 2020 will be taking place at the Fraunhofer Forum, Berlin.

Anna-Louisa-Karsch-Str. 2
10178 Berlin, Germany
www.forum.fraunhofer.de